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Test Service

Test Service

Overview

Test Flow.
Request
Incoming Inspection
Test
Outgoing Inspection
Packing
Shipping

Test Web Report (Real-time monitoring)

Wafer Test Flow.

Incoming Incoming

  • ·Visual and AVI

Probe Test Probe Test

  • ·Electrical test
  • ·Hot/Cold test
  • ·Function test
Option

Inking/bake Inking/bake

Outgoing inspection

  • ·Visual and AVI

Packing and Shipping

Option
Final Test Flow.

Incoming Incoming

  • ·Visual

Package Test Package Test

  • ·Electrical Test
  • ·Hot/Cold test
Option

Quality Electrical Test

  • ·Sampling inspection

Baking Baking

  • ·Moisture Removal Process
  • ·Skip the baking process based on the type of packaging
Option

Visaul Inspection

  • ·Foreign material, Crack check

Outgoing inspection

  • ·LIS
Option

Tape & Reel Process

  • ·According to shipping method

Packing and Shipping

Option
Engineering Service.
  • Engineering Support Including Test Program Development
  • Consultation on Test Configuration for Various Products and Locations
  • Engineering Services Including Analysis of Defects and Characteristics Specific to Products
  • Wide range of tester platforms
Competitive Advantage.
  • 01.Excellent Test
    Engineering

    Leveraging prior development experience in digital, high-end mixed signals, heavy analogs, and RF products, we are capable of developing a diverse array of products

  • 02.Cost effective
    operation

    By continuously expanding our capabilities and improving technology (Multitest) against the backdrop of a stable financial structure, we secure a competitive edge in pricing

  • 03.Wide range of
    tester platforms

    Our extensive inventory of equipment, such as Verigy 93K-PS800/3600, UltraFLEX, IFLEX, mFlex, ETS364/88/300, enables us to meet a broad spectrum of customer needs

Technology owned by the company
  • Research & Development (R&D)

    ·Proprietary interface design capabilities

    ·Capable of developing tests tailored to specific application fields

    ·Equipment-specific conversion technology

  • Process technology

    ·Development of a production system tailored for small-scale, diverse product manufacturing

    ·Expertise in repair technologies, including ProbeCard

    ·Minimization of Turn-Around Time (TAT) operations and enhanced responsiveness

  • IT Infra

    ·Real-time monitoring of processes

    ·Data analysis reporting

    ·Bin failure reporting

Application

GMTest offers comprehensive solutions for a wide range of package tests, including Mixed & RF Test, Broad Band, Wireless/Mobile, RF/Analog, and Digital consumer. We are equipped to test devices across various functions, sizes, and types. Leveraging our extensive technological expertise, we deliver all the test engineering services our customers need, such as Test Plan & Test Program Development, and Hardware Design for prototype testing.

SYSTEM IC
  • # MCU
  • # SoC
  • # Custom IC
  • # DSP, ISP
  • # AI
  • # Audio
IoT & Sensor
  • # Controller
  • # MCU
  • # Security
  • # Touch Sensor
  • # Memory

Wafer Test

Additionally, GMTest provides Wafer Probe Test and Bumped Wafer Cold Test capabilities. With our rich technological background, we offer comprehensive test engineering services, including the development of test plans and programs, as well as prototype hardware design and testing.

Tester
Model Maker Specification Option
Micro Flex Teradyne Digital, DC, Mixed HSD200 / DC30 / DC75 / DC80 / DC90 / BBAC
Integra Flex Teradyne Digital, DC, Mixed HSD200 / DC30 / DC75 / DC80 / DC90 / BBAC
Uflex Teradyne Digital, DC, Mixed UP1600 / UVI80 / DC80 / UPAC80
Verigy93K Advantest Digital, DC, Mixed PS800 / PS1600 / MSDPS / AVI64 / VI32 / MCA / MCB
T2000 LSMF Advantest Digital, DC, Mixed DM800MHZ / PMU32 / DPS500mA / LCDPS / AAWGD / BBWGD / JMM / RC5V
T2000 MSMF Advantest Digital, DC DM125MHZ / DPS500mA / LCDPS / HCDPS
ETS-364 Teradyne Digital, PMIC SPU-100, APU-12,DPU-16,QMS,QTMU
PROBER
Other equipment Specification
PROBER 8" ~ 12" Option, Hot & Cold Option
AVI 8" ~ 12" Wafer AVI

Final Test

Tester
Model Maker Specification Option
Integra Flex Teradyne Digital, DC, Mixed HSD200 / DC30 / DC75 / BBAC / VHFAC
Micro Flex Teradyne Digital, DC HSD200 / DC30
J750 Teradyne Digital, DC HSD100 / HSD200 / APMU
Verigy93K Advantest Digital, DC, Mixed PS800 / PS1600 / PS9G / MCA / MCB / VI32 / MSDPS / DPS64
T2K-IPS(Non-EPP) Advantest Digital, PMIC DM250Mbps, DM800Mbps, MMXH, MFHP
T2K-IPS(EPP) Advantest Digital, PMIC 1GDMbps, MFHP, GVI64
ETS-364 Teradyne Digital, PMIC SPU-100, APU-12, DPU-16, QMS, QTMU
HANDLER
Other equipment Specification
Horizontal Handler - In / Out Arm : 4Hands Or 8Hands
- Temp Range : -55 ~ 130 ℃
Turret Handler - Test : Max 8PARA
- Visual Inspection (2D, 3D)
- Tape & Real : QFN / MLF (1x1 ~ )

Back End

LIS Process
  • ·Lead Inspection System
  • ·The process involves determining the quantity and identifying defects, as well as sorting quality chips that passed the final test by examining their external condition.
  • ·Items subject to inspection
Ball Pitch
Ball Offset
Ball Width
Ball Quality
Body Dimensions
Grid-to-Package Offests
Ball Coplanarity
Warpage
Ball Height
Ball Coplanarity
T&R
  • ·Tape & Reel
  • ·The process involves drying chips that have passed the visual inspection in a bake oven for a designated period specific to each product, and then packaging them in carrier tape.
  • ·Input supplementary Materials
    • -Cover Tape: A transparent tape that, when heated, adheres to the carrier tape to prevent the displacement of chips placed on the carrier tape.
    • -Empty Reel: Auxiliary material utilized for storing and transporting finished products.
    • -Carrier Tape: A method of product shipment, it is a tape with a non-flat surface designed to aid in the storage and transport of products.
Packing
  • ·Vacuum packing, Small Box
  • ·The process involves final shipment preparation by packaging according to customer-specified packaging specifications, divided into Tape & Reel or Tray Type.
  • ·The process includes placing materials, Hi Card, and Desspak in an A/L Bag as per customer standards and then vacuum-sealing them using equipment.
FGS Process
  • ·Finished Good Store
  • ·Store items that have finished inner box packaging and prepare the outer box.
  • ·Store items with completed outer box packaging and dispatch them according to customer orders.
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© GMTEST co.,ltd. All Right Reserved.

31043 48 Seonggeosandan 1-ro, Seonggeo-eup, Seobuk-gu, Cheonan-si, Chungcheongnam-doTel. +82 41 410 2600